On-Demand Youth Leadership Program: Nepal-STEM

Student Application

The On-Demand Youth Leadership Program (ODYLP): Nepal-STEM is an initiative of the U.S. Department of State’s Bureau of Educational and Cultural Affairs (ECA), administered by Legacy Internationalthat brings together approximately 16 youth participants (ages 15-18) and  two adult mentors from Nepal for a three-week U.S.-based exchange focused on empowering young women in science, technology, engineering, and mathematics.

 

Youth applicants must:

  • Be young women between 15 and 18 years old by May 1, 2024;
  • Have at least one semester left at their current school upon return home;
  • Be a citizen of Nepal.  (Note: Individuals with dual U.S. citizenship are not eligible for this program);
  • Be living in Nepal at the time of the exchange and during the follow-on component;
  • Have proficiency in English;
  • Demonstrate interest in youth leadership development;
  • Demonstrate initiative, strong communication skills, and an energetic, positive attitude;
  • Have the ability to work cooperatively in a team and be open to various opinions and perspectives;
  • Commit to the follow-on application of community-based project (e.g., peer education workshop or service project); and
  • Have permission from parent(s) or legal guardian(s) to participate in the program.

Please note that preference will be given to individuals who:

  • Have not previously traveled to the United States.
  • Have not participated in any in-person ECA-funded program in the United States within the past three years or accepted a scholarship for an upcoming U.S. Government-funded exchange program.
  • Family members of U.S. Embassy or Consulate staff, or U.S. Department of State employees are not eligible.

Watch this video on how to apply!

Read this Application Frequently Asked Questions Resource

There is NO application fee.

The United States Government will pay for all travel to and from the United States, and all program-related costs for selected participants.

Application deadline is February 5, 2024 at 12:00pm (noon) Eastern Daylight Time

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